Henry C. Williams

Assoc. Dir, Engineering • Packaging Center of Excellence

Role
Associate Director of Global Packaging Technology at Organon
Location
Rockford, IL, US
LinkedIn followers
500 followers

About Henry C. Williams

Quality-focused engineering manager with over fifteen years of experience in machine tool, automation, and pharmaceutical industries. Recognized for accomplishments in driving OEE of 15% on average for multiple projects. Successfully managed 50+ individuals with a $12M CAPEX budget. Collaborated with multiple sites for integrations of a serialization processes for fulfillment of pharma government mandates. Visionary leader who leads through knowledge of technical equipment and respect to create profitability through cost leadership, differentiation, and focus.

Experience

  1. Associate Director of Global Packaging Technology

    Organon

    Apr 2022 — Present · US

    Packaging Equipment Assessmemt-Global Automation Alignment and Strategies -Serialization Equipment and Process-Onboarding of CMOs & CDMOs-Global Technology Transfers -URS/FRS Developement-CAPEX Planning and Execution-A.I. Group Implementation-AR/VR/XR RealWear/Hololense Modeling -IOPP

Education

  • University of Northern Iowa

    B.S., Electrical Engineering / Technology Management

    2003 — 2006

  • Indian Hills Advanced Technology Academy

    AAS, Micro Electronics

    2000 — 2002

  • Indian Hills Advanced Technology Academy

    AAS, Robotics Engineering and Automation

    2000 — 2003

  • MIT Sloan School of Management

    Certificate: Artificial Intelligence Implications for Business

    2019

  • MIT Sloan School of Management

    Master of Business Administration - MBAn, Business Analytics

    2018 — 2019

Skills

  • Human Machine Interface
  • Industrial Control
  • Electronics
  • Devicenet
  • Design for Manufacturing
  • Ladder Logic
  • Hydraulics
  • Machine Tools
  • Programming
  • Wincc
  • Servo
  • Plc
  • Schematic
  • Plc Programming
  • Machine Design
  • Motion Control
  • Hmis
  • Continuous Improvement
  • Control Systems Design
  • Manufacturing
  • Factorytalk
  • Robotics
  • Pneumatics
  • Product Design
  • Manufacturing Engineering
  • Machine Vision
  • Control Logic
  • Machinery
  • Electrical Controls
  • Troubleshooting
  • Industrial Ethernet
  • Process Control
  • Autocad
  • Automation
  • Solidworks
  • Allen Bradley
  • Allen-Bradley
  • Plc Allen Bradley
  • Fanuc
  • Power Distribution

Find verified contacts for anyone on LinkedIn

Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.

Free plan included · No credit card required

This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.

Henry C. Williams — Associate Director of Global Packaging Technology at Organon in Rockford, IL, US | Unifers