Harsh V.
R&D Packaging Engineer at Intel Corporation
- Role
- R & d Packaging Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Harsh V.
Hey there! I\'m Harsh Pyarelal Verma, a Mechanical Engineer based in the USA. Dive into my…
Experience
R & d Packaging Engineer
Apr 2024 — Present · OR, US
Education
Pandit Deendayal Petroleum University, Gandhi Nagar
Bachelor's degree
2016 — 2020
Arizona State University
Master of Science - MS
2021 — 2023
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.