Hai Ta
RF Modules | IC Packages Design Engineer at Apple
- Role
- Rf Modules Ic Packages Design Engineer at Apple
- Location
- Los Angeles, CA, US
- LinkedIn followers
- 500 followers
Experience
Rf Modules Ic Packages Design Engineer
Jul 2021 — Present · San Diego, CA, US
Education
University of California, Davis
PhD
2007 — 2012
Posts and Telecommunications Institute of Technology
BS
2000 — 2004
University of California, Davis
MS
2007 — 2009
Skills
- Hfss
- Ads
- Sonnet
- Rf
- Matlab
- Cst Microwave Studio
- Microwave
- Ansys
- Allegro
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