Gunit Singh Chabhra
Modem Firmware Developer| LTE & NR Phy Layer|RTOS| AI
- Role
- Senior Lead Engineer at 高通
- Location
- Hyderabad, TG, IN
- LinkedIn followers
- 500 followers
About Gunit Singh Chabhra
I am currently part of the Qualcomm Modem Firmware team, where my primary responsibilities include requirement gathering, design, code development, and issue triaging—focusing on stability, performance, power, and certification for Narrow Band modules across various Qualcomm Modem families.I collaborate with cross-functional teams to address complex system-level challenges and possess a strong understanding of LTE and NR physical layers. My experience spans the entire modem lifecycle, from conceptualization to commercialization.Previously, I worked on stability testing for various Qualcomm Mobile SOCs, contributing to the development of stability test plans and automating chipset testing using Python and Shell. I have in-depth knowledge of SOC internal subsystems, including CPU, DSP, and Modem.As part of a team, I participated in the India Innovation Challenge Design Contest (IICDC-2017), where we received the Chairman Award for Tech Innovation for developing customizable Battery Management System (BMS) solutions for Li-ion batteries.I am proficient in C, C++, SQL, Python, UML, Machine Learning, Data Structures and Algorithms, RTOS, design patterns, and Operating Systems. Additionally, I have hands-on experience with microcontrollers such as ATMEGA 32, Arduino, STM32F7, CC3200, and TMS 57004. My interests include 4G, 5G, AI, and embedded systems.
Experience
Senior Lead Engineer
Dec 2023 — Present · Hyderabad, IN
Education
ST PAULS SCHOOL JODHPUR
High School, Political Science and Government
1997 — 2011
Indian Institute of Technology, Kharagpur
Master’s Degree, Embedded Control & Software
2016 — 2018
Maulana Azad National Institute of Technology
Bachelor’s Degree, Electronics and Communications Engineering
2012 — 2016
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