Gaurav Mehrotra
Sr Manager Ic Package Development @Renesas Electronics
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WORK HISTORY
Sr Manager Ic Package Development @Renesas Electronics
San Jose, CA, US
Leading MEMS & Sensor Packaging Team at Renesas. Developing highly complex sensor modules and SiP for medical, industrial, commerical, and automotive applications. Optical/biosensor, Environmental MEMS Sensors (Gas, Humidity, Pressure, Air Quality/Particle matter), Flow, Thermopile, Ultrasound, Implantable continuous glucose monitoring sensor (Eversense™), WLCSP/Bumping, SiP for mmWave/5G, FCCSP
EDUCATION
Georgia Institute of Technology
MS, Materials Science & Engineering
Indian Institute of Technology, Kanpur
B.Tech, Materials & Metallurgical Engineering
ABOUT GAURAV MEHROTRA
Innovative IC Packaging Technologist and leader with extensive experience in packaging technology development, materials, and processes. Broad-based expertise in Wire bond, Flip-Chip, WLCSP, TSV, Fanout, RF/mmWave and MEMS & Sensor Packaging, Assembly & Reliability. A self-starter and motivated leader with proven record of managing crucial programs involving cross-functional, international stakeholders. A multi-tasker and high velocity problem solver, a critical and independent thinker, and an engineering entrepreneur- Packaging Technology Evaluation & Roadmap - Package Definition - Packaging Technology Selection - Substrate Technology Selection - Design Review - DFM - Platform / Package Qualification and Technology Envelope - Package Assembly Process Development - Package Yield Improvement - Component and Board Reliability - Package Failure Root Cause Analysis - Supplier and OSAT Management - New Product Introduction and Ramp - Customer Communication
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