Gaurang Choksi
Vice-President, Technology Development; Director, Core Competencies - Assembly & Test Tech Development, Intel Corporation
- Role
- Assembly & Test Technology Development at Intel
- Location
- Chandler, AZ, US
- LinkedIn followers
- 500 followers
About Gaurang Choksi
During my 35+ year tenure at Intel in the areas of electronic packaging, I have contributed to various areas including structural analysis and testing, electrical and physical design and analysis of multi-chip modules, design/analysis tool development for packages/boards, and thermal technologies and solutions. The scope of the teams I have managed include materials selection and characterization, dimensional measurements, and modeling and validation related to structural integrity, power delivery, high speed signaling, thermals and heat dissipation, and fluid flow to support design and technologies related to electronic packaging, assembly and test technologies. Teams I have set up and mentored include modeling/simulation groups and labs in Arizona, Oregon and Malaysia and served on academic and national advisory / review boards.
Experience
Assembly & Test Technology Development
May 1988 — Present · Chandler, AZ
Education
Virginia Tech
PhD, Engineering Science & Mechanics
College of Engineering, Guindy
Bachelor's degree, Mechanical Engineering
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