Gang Duan
Advanced Packaging | Heterogeneous Integration | EMIB/EMIB-T | Organic/Glass Substrate | Adv. Panel Level Packaging (RDL/TSV Bridges) | Package Assembly | 2024 Intel IOTY | Lean Six Sigma Black Belt
- Role
- Executive VP at Samsung Electro-Mechanics
- Location
- San Jose, CA, US
- LinkedIn followers
- 500 followers
About Gang Duan
Seasoned Engineering & Business Executive Leader with over 18 years of experience in the Microelectronics Packaging Industry. Proven track record of blending deep technical expertise with strategic business acumen to drive global growth and operational excellence.* Global Business & Technology Development: Expertise in fostering strategic partnerships, leveraging deep technical competence to engineer innovative solutions, and driving market expansion to enhance customer engagement and accelerate global growth.* Executive Leadership & Organizational Strategy: Proven ability to manage highly skilled, innovative teams and shape complex organizational structures to achieve ambitious business and technical objectives.* Strategy to Execution: Track record of defining strategies and leading cross-functional teams to successfully deliver prototypes, and manage high-volume production cycles.* Operational Excellence: Spearheaded initiatives across Factory Operations, Supplier Development, Supply Chain Management, Yield / Reliability Improvement, Quality Assurance, and High-Volume Manufacturing.* Prolific Inventor / Innovator with 325+(US)/ 600+(Worldwide) issued / pending patents, and 50+ technical papers in highly regarded academic journals and industry conferences (5200+ citations) in the field of packaging architectures /processes/materials technologies. Recognized as the 2024 Intel inventor of the year (IOTY) and Intel TD’s Top 5 inventors in 2023 & 2025 (While at ECTC Interconnects Committee Chair, Build-Up Substrate Symposium (BUSS) program committee member, International Semiconductor Industry Group (ISIG) USA Advisory Board member.
Experience
Executive VP
Aug 2025 — Present · San Jose, CA, US
Executive VP - Application Engineering / Technology Marketing - Substrate / Package Solution* Lead a global customer engagement engineering and BD organization to scale the package solution business.* Drive strategic partnerships to accelerate customer success across key and emerging segments, including AI/ML Compute, Hyperscale / Datacenter, Autonomous Driving, Mobile AP, Client, Memories, and Beyond.* Shape the customer-driven advanced packaging substrate technology roadmap for the AI era, focusing on improving mechanical robustness, power delivery efficiency, signal integrity, I/O density, and overall manufacturing effectiveness.
Education
Caltech
Ph.D, Materials Science - Simulations, Modeling, and Designs of Bulk Metallic Glasses
2002 — 2007
Caltech
Master, Electrical Engineering
2004 — 2006
Skills
- Photolithography
- Sputtering
- Statistical Process Control (Spc)
- Nanotechnology
- Thin Films
- Spc
- Scanning Electron Microscopy
- Materials Science
- Failure Analysis
- Simulations
- Cross-Functional Team Leadership
- Characterization
- Continuous Improvement
- Ic
- Design of Experiments
- Process Engineering
- Afm
- Research and Development (R&D)
- Jmp
- Engineering Management
- Chemical Vapor Deposition (Cvd)
- Supplier Quality Management
- Cvd
- Integrated Circuits (Ic)
- Matlab
- Product Development
- Product Engineering
- Management
- Electronics Packaging
- Metrology
- R&D
- Supply Chain Management
- Silicon
- Semiconductors
- Mems
- Six Sigma
- Fmea
- Process Integration
- Lean Manufacturing
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.