Gabriel Gurule

About Gabriel Gurule

Currently a Module Engineer at Intel Fab 11X (Rio Rancho, NM). I specialize in Thin Films METALS Technology Development, focusing on PVD (Physical Vapor Deposition) and advanced metallization processes for next-generation semiconductor fabrication. My role supports process integration, equipment optimization, and high precision manufacturing. I am also the CFO and Co-Founder of Aeralytic, a startup building vehicle mounted environmental sensors that provide real time, high resolution air quality data and environmental data. I lead financial operations funding strategy, and go-to-market planning. Currently am developing partnerships with cities, universities, and environmental agencies.I hold a B.S. in Mechanical Engineering from the University of New Mexico, with a concentration in MEMS (Microelectromechanical Systems). My academic work included cleanroom fabrication, thermal actuator design, and MEMS-based energy harvesting. This has shaped my cross functional approach to technical leadership and innovation.

Experience

1. Module Engineer C4 (Controlled Collapse Chip Connections) Intel Fab 11x

   Intel

   Feb 2026 — Present

   Leading advanced semiconductor manufacturing processes for C4 bump technology, specializing in thin film deposition, metrology, and thermal processing. Working with tools across PVD (Physical Vapor Deposition), Wet Etch, Diffusion, and Metro equipment to ensure optimal performance and yield for critical interconnect technologies.Key Responsibilities: • Drive process development and optimization for C4 thin film applications, TF-Metro characterization, and reflow cure operations • Own and maintain critical manufacturing tools including PVD, Wet Etch, Diffusion, and Metrology systems • Develop custom automation solutions and applications to enhance operational efficiency and process control • Create advanced PowerBI dashboards and analytics reports to drive data-driven decision making and process improvements • Collaborate with cross-functional teams to support next-generation packaging technologies and manufacturing excellenceFocused on delivering breakthrough performance in controlled collapse chip connection manufacturing technologies while implementing digital solutions that optimize manufacturing workflows and enhance operational visibility.

Education

• The University of New Mexico

  Bachelor of Science - BS, Mechanical Engineering