Fonzell Martin
Sr Package Engineer at NXP Semiconductors
- Role
- Package Architect at NXP Semiconductors
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Fonzell Martin
An experienced Senior I.C Packaging Engineer and Project Manager with a proven track record of leading complex packaging projects from concept to production and successfully deploying new packaging technology. Broad background in semiconductor packaging, new product introduction, back-end manufacturing, assembly subcontractor operations, DOE methods, project management and program management. Excellent ability to communicate at all levels in the organization and lead global cross functional teams.
Experience
Package Architect
Dec 2015 — Present
Education
The University of Texas at Austin
BS, ME
1985 — 1990
Skills
- Failure Analysis
- Semiconductor Industry
- Spc
- Testing
- Semiconductors
- Product Development
- Cross-Functional Team Leadership
- Ic
- Design of Experiments
- Manufacturing
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