Feras Eid

About Feras Eid

I am a semiconductor packaging specialist with an emphasis on engineering novel solutions to address thermal and mechanical challenges in consumer electronics as well as servers in datacenters and high performance computing systems- In my role at Intel, I led cross-functional research projects and teams to enable new disruptive technologies and continued roadmap scaling. Before that, I was a researcher at MIT where I attained my PhD in mechanical engineering with a focus on MEMS and nanotechnology- I am passionate about innovation and have filed over 120 patents, led multidisciplinary teams consisting of internal stakeholders from different organizations as well as external suppliers, and engaged with universities in successful research partnerships- My expertise spans the entire R&D lifecycle from ideation to high volume manufacturing. My focus areas include chip-package interactions and mechanics, thermal management, materials (e.g, organic substrates, TIMs, underfills, molding compounds, solders), MEMS and organic substrate fabrication (e.g, process flows, mask design, thin film deposition, photolithography, plating, lamination, etching, wafer bonding), assembly (e.g, chip attach, epoxy/sealant dispense, lid attach), and reliability requirements- Some of my software competencies include multi-domain analytical modeling, FEA/FEM/CFD numerical simulation (e.g, ANSYS, Abaqus, Icepak), programming languages (e.g, MATLAB, C++), and CAD tools (e.g, SolidWorks, AutoCAD).

Experience

1. Tech Lead (Ai Ml Physical Infrastructure)

   Google

   Mar 2025 — Present

   AI/ML and Datacenter Physical Infrastructure (Hardware Systems)

Education

• Massachusetts Institute of Technology

  Master of Science

• American University of Beirut

  Bachelor of Engineering

• Massachusetts Institute of Technology

  Doctorate

Skills

• Programming Languages (C++, Matlab, Visual Basic, Macros)
• Numerical Simulation (Ansys, Icepak)
• Solidworks
• Simulations
• Cad
• Mems
• Manufacturing
• Thin Films
• Mems Device Engineering
• Multi-Domain System Modeling and Design
• Finite Element Analysis
• Cad (Solidworks, Pro/E, Autocad)
• Thermal Management
• Microfabrication