Abdullah Fahim
Packaging R&D Engineer at NXP Semiconductors
- Role
- Semiconductor Packaging Engineer (R & d) at NXP Semiconductors
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
About Abdullah Fahim
Ph.D. in Mechanical Engineering with 7 Years of Research Experience. 5 Years of Research Experience in Mechanical Testing and Reliability of Board Level Package Materials.Characterization, Failure Behavior and Micro structural Study of Package Materials (Extensive Work on Solder Interconnects in Electronic Packages). Experienced in Various Material Characterization Tools (Nanoindentation, Micro-Tension Torsion Machine, Instron Fatigue Testing, Drop, Shock and Vibration Testing). Skilled in Reliability and Statistical Analysis Tools (JMP, Weibull Plot). Experienced in Failure Analysis Technique: Cross-sectioning, Polishing, Optical Microscopy, SEM, EDS). Experienced in Finite Element Simulation to Understand the Board Level Reliability of PBGA Packages. Experienced in Various Material Characterization Technique of Polymeric Materials (DSC, TGA, DMA, FTIR ).
Experience
Semiconductor Packaging Engineer (R & d)
Jun 2021 — Present · Austin, TX, US
Education
Auburn University
Doctor of Philosophy (Ph.D.), Mechanical Engineering
2014
Tuskegee University
Master's Degree, Materials Science & Engineering
2012 — 2014
Skills
- Finite Element Analysis
- Matlab
- Solidworks
- Ansys
- Optical Microscopy
- Scanning Electron Microscopy
- Atomic Force Microscopy
- Dynamic Mechanical Analysis
- Thermogravimetric Analysis
- Differential Scanning Calorimetry
- Research
- Microsoft Excel
- Mechanical Engineering
- Labview
- Simulations
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