Gobinath Seenivasan

About Gobinath Seenivasan

I’m a Mechanical Engineer specializing in semiconductor capital equipment (PVD/etch, RF match, gas delivery & vacuum packaging). Across 8+ years, I’ve driven new product development from concept to release—NX/SolidWorks/Creo modeling, ASME Y14.5 GD & T/stack‑ups, Teamcenter workflows, and sheet‑metal/weldment designs that hit cost, quality, and manufacturability targets.Selected impact:• Cut drawing release cycle time by 22% by standardizing MBD/AMAT detailing & BOM workflows.• Improved chamber reliability (MTBF +12%) via tolerance stack‑ups and redesigned mounts/brackets.• Reduced part cost 28% by DFM/DFA and supplier co‑development on gas panel assemblies. MLO creation, And expert in Sandbox work method.Core: NX, SolidWorks, Creo, Inventor | GD & T (ASME Y14.5‑2018)| Sheet Metal/Weldments | FEA reviews PLM: Teamcenter/Windchill | DFM/DFA/DFMEA | SEMI S2 considerations | Vacuum/Gas systems.I collaborate with global teams (EU/NA) and enjoy patenting practical mechanisms. Open to roles in semiconductor equipment design across Europe/Canada/Middle East. Let’s connect to discuss how I can accelerate your next module or retrofit program.I’m known for my attention to detail, strong technical aptitude, and ability to adapt quickly to new technologies. I’m currently seeking international opportunities where I can apply my skills in a challenging, innovation-driven environment. Core Skills: SolidWorks, Creo, Inventor, Tolerance Stack‑ups, Sheet Metal Design, Weldments, Gas Delivery Systems, Vacuum Systems, RF Match Assemblies, PVD/Etch Modules, DFM/DFA/DFMEA, MBD, BOM Management, Fixture Design, FEA reviews (ANSYS/Abaqus), SEMI S2 considerations. Open to relocation and visa sponsorship opportunities in Europe, Canada, and the Middle East.

Experience

1. Senior Mechanical Design Engineer

   Applied Materials

   Sep 2022 — Present · Bengaluru, IN

   Lead the detailed design and development of mechanical systems including material and component selection, CAD modeling, 2D detailing, and drawing release using Siemens NX.*Specialized in sheet metal design, structural development, and GD & T with stack-up analysis, ensuring manufacturability and compliance with ASME and SEMI standards.*Designed and developed HVM and PVD panel etching modules, including RF match assemblies, chamber designs, and electrical packaging for hybrid bonding systems.*Conducted system and package studies to support new product development, ensuring integration with surrounding components.*Created conceptual designs for prototypes, aligning with manufacturing processes and standards.*Developed sheet metal components such as pallets and mounting brackets for gas panel assemblies.*Prepared 2D drawings and MBD documentation for gas line weldments and sheet metal parts, adhering to AMAT standards.*Reviewed engineering changes with cross-functional teams, resolving quality issues and ensuring design integrity.*Generated Retrofit BOMs and assembly instructions, and managed quality checks and drawing releases via Teamcenter.

Education

• Ramakrishna Mission Vidyalaya

  DME, Mechanical Engineering

  2010 — 2013

• Anna University of Technology Madurai, Ramnad Campus

  Bachelor's degree, Mechanical Engineering