Eddie Bononcini

Process Engineer

Role: Process Engineer at 3d Glass Solutions, Inc
Location: Albuquerque, NM, US
LinkedIn followers: 500 followers

About Eddie Bononcini

Experienced Senior Process Engineer with a demonstrated history of working in the semiconductors industry. Skilled in Continuous Improvement, Semiconductor Industry, Manufacturing, Lean Manufacturing, and Testing. Strong operations professional with a Bachelor of Science (B.S.) focused in Electrical and Electronics Engineering from The University of New Mexico.

Experience

Process Engineer
3d Glass Solutions, Inc
Feb 2025 — Present · Albuquerque, NM, US

Education

The University of New Mexico
Bachelor of Science (B.S.)
1990 — 1995

Skills

Statistical Process Control (Spc)
Semiconductor Industry
Spc
Lean Manufacturing
Project Management
Continuous Improvement
Process Engineering
Testing
Six Sigma
Semiconductors
Cross-Functional Team Leadership
Process Improvement
Design of Experiments
Manufacturing
Jmp
Engineering

Contact information

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Work email
•••••@3dgsinc.com
Personal email
•••••@•••••.com
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Current company

3d Glass Solutions, Inc

Appliances; Electrical; and Electronics Manufacturing · 66 employees · Albuquerque, New Mexico, United States

3D Glass Solutions, Inc.(3DGS) is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico. 3DGS’ main operations are focused on the fabrication of electronic system and devices using photo-definable glass-ceramics. 3DGS manufactures a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries. 3DGS has created foundational patent positions related to all photo-sensitive glass-ceramic materials and devices. 3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, & manufacturing) related to glass-ceramic devices for the electronics packaging industry. 3DGS leverages its unique product solutions providing device manufacturing and systems integration services for a number of standard and custom products. We provide our customers complete glass-enabled systems integration services. Our aim is to provide our customers with an integrative solution in RF electronics and IC packaging that allows them to integrate more components onto a single platform while decreasing overall manufacturing costs.

3dgsinc.com

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