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Ed Besseler

Smt Pcba Manufacturing Development Engineer @Snap Inc.

San Francisco, CA, US
EMAILS
e••••••••@snap.com
MOBILE NUMBERS
+14•••••••32

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WORK HISTORY

Sep 2022 — Present

Smt Pcba Manufacturing Development Engineer @Snap Inc.

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Santa Monica, CA, US

Design and Process development of electronic printed circuit boards (PCB/PCBA) for AR/VR devicesResponsible to drive miniaturization initiatives on the electronic assemblyDevelopment of new contract manufactures Define manufacturing processes and support builds worldwide

EDUCATION

1999 — 2004

Universidade Estadual de Campinas

College, Physics

2006 — 2008

Universidade Estadual de Campinas

Master, Electrical Engineer

1994 — 1997

Fundação Bradesco

Technical, Electronics

SKILLS

SmtCoachingElectronicsSix SigmaLean ManufacturingProcess EngineeringMinitabFmeaTestingManufacturingContinuous ImprovementSpcDesign for ManufacturingDesign of ExperimentsManufacturing EngineeringProduct DevelopmentProject ManagementRoot Cause AnalysisElectronics ManufacturingPcb DesignEngineering ManagementEngineeringFailure AnalysisDmaicQuality SystemGreen BeltProcess Simulation5sAutomationIndustrial EngineeringQuality ControlIso 9000KaizenManufacturing Operations ManagementIsoSupplier QualityQuality ManagementKanbanPpapFailure Mode and Effects Analysis (Fmea)

ABOUT ED BESSELER

Master in Electrical Engineering, Major in Physics and Electronic Technician* Trilingual (English, Portuguese and Spanish)* Worldwide experience in Electronics Manufacturing * 25+ years of experience in PCB/FPC assembly * Design for Manufacturing (DFM) and New Products Introduction (NPI) expert* Experience in production lines design and start up.* Experience and ability in team management.* Critical analysis and creative in problems solving.* Green Belt / 6Sigma / IPC / ISO

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