Drew Rohskopf
Thermal Engineer @Apple
San Francisco, CA, US
EMAILS
a••••••••@apple.com
MOBILE NUMBERS
+14•••••••13
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WORK HISTORY
Sep 2023 — Present
Thermal Engineer @Apple
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Chip level design for energy efficiency and performance scaling.
SKILLS
Heat TransferC++High Performance ComputingApplied MathematicsCMachine LearningUnixMolecular DynamicsThermodynamicsParallel ComputingArtificial Neural NetworksGlobal OptimizationFluid DynamicsLammpsFluid MechanicsMatlabNumerical AnalysisGenetic AlgorithmsStatistical Data AnalysisLinuxDensity Functional TheoryFinite Element AnalysisVaspPythonArtificial Intelligence
ABOUT DREW ROHSKOPF
Background in - Nano to macro heat and energy transport, thermal physics & …
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