Benjamin Stafford
Reliability Engineer - Plasma Process Damage @Infineon Technologies
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WORK HISTORY
Reliability Engineer - Plasma Process Damage @Infineon Technologies
Munich, DE
Plasma-induced processing damage (PID) reliability qualification of CMOS technologies (SOI, 3DIC, Power)-Developing reliability test methodology for PID, NBTI & dielectric stress tests-Implementing fast wafer level reliability monitoring process (in-line dielectric, device & metallisation reliability tests)-Ownership & development of dielectric test algorithms (HP BASIC & C)-Developing test plans-Developing e-test structures
EDUCATION
Trinity College Dublin
B.A. (Mod.), Physics and Chemistry of Advanced Materials
Technische Universität Dresden
Doctor of Philosophy (Ph.D.), Physics
Wesley College, Dublin
Leaving Certificate
Technical University of Munich
MSc, Advanced Materials Science
ABOUT BENJAMIN STAFFORD
An experienced materials engineer & physicist with a passion for technology development-Qualified numerous semiconductor technologies (CMOS, SOI, 3DIC) for reliability, specifically plasma processing-induced charging damage (PID)-Implemented in-line reliability monitoring in fabs-Developed novel high-temperature superconductor HTS tapes using hetero-epitaxy & high-current cryogenic testingI love investigating, experimenting and synthesising information to solve complex problems. Well-rounded skills in communication from working in Germany, Ireland and Brazil.
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