Benjamin Stafford

Reliability Engineer - Plasma Process Damage @Infineon Technologies

Munich, DE
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Jan 2022 — Present

Reliability Engineer - Plasma Process Damage @Infineon Technologies

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Munich, DE

Plasma-induced processing damage (PID) reliability qualification of CMOS technologies (SOI, 3DIC, Power)-Developing reliability test methodology for PID, NBTI & dielectric stress tests-Implementing fast wafer level reliability monitoring process (in-line dielectric, device & metallisation reliability tests)-Ownership & development of dielectric test algorithms (HP BASIC & C)-Developing test plans-Developing e-test structures

EDUCATION

2006 — 2010

Trinity College Dublin

B.A. (Mod.), Physics and Chemistry of Advanced Materials

2012 — 2018

Technische Universität Dresden

Doctor of Philosophy (Ph.D.), Physics

2000 — 2006

Wesley College, Dublin

Leaving Certificate

2010 — 2012

Technical University of Munich

MSc, Advanced Materials Science

ABOUT BENJAMIN STAFFORD

An experienced materials engineer & physicist with a passion for technology development-Qualified numerous semiconductor technologies (CMOS, SOI, 3DIC) for reliability, specifically plasma processing-induced charging damage (PID)-Implemented in-line reliability monitoring in fabs-Developed novel high-temperature superconductor HTS tapes using hetero-epitaxy & high-current cryogenic testingI love investigating, experimenting and synthesising information to solve complex problems. Well-rounded skills in communication from working in Germany, Ireland and Brazil.

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Benjamin Stafford — Reliability Engineer - Plasma Process Damage at Infineon Technologies in Munich, DE | Unifers