Dong Hun Lee

Ph.D. (ME,MET)

Role
Research Development Thin Flim Staff Process Engineer2 at Samsung Semiconductor
Location
West Lafayette, IN, US
LinkedIn followers
500 followers

About Dong Hun Lee

Driven by a passion for innovation in autonomous vehicle technology, I bring a deep technical background and a research-focused mindset to advancing mobility solutions. With a Ph.D. in Mechanical Engineering Technology, my expertise spans object detection, autonomous systems, semiconductor design, and thin-film fabrication(PVD)—critical components in the evolution of self-driving technology.My master\'s research concentrated on Lidar sensors and sensor fusion, essential for enhancing perception and navigation in autonomous vehicles. Combined with my undergraduate foundation in robotics, control systems, and leadership, I have developed a multidisciplinary approach to solving complex engineering challenges.From refining sensor accuracy to optimizing AI-driven vehicle intelligence, I am eager to contribute to the next generation of autonomous transportation. Whether through research, development, or collaboration, my goal is to help shape a future where vehicles are safer, smarter, and more autonomous.

Experience

  1. Research Development Thin Flim Staff Process Engineer2

    Samsung Semiconductor

    Oct 2025 — Present · Gyeonggi, KR

    Develop advanced PAD dielectric and inter-die fill processes for next-generation HBM and 3DIC advanced packaging.Lead process design and optimization of TSV liner and metal fill technologies for thermal resistance reduction and warpage control at the chip level.Evaluate CVD, PVD-based dielectric materials and perform thermal resistance, bonding and warpage characterization through experimental data and equipment vendor demo tests.Conduct thin-film deposition and materials characterization (XRD, SEM, XPS, etc.) to analyze surface and compositional properties for process reliability enhancement.Collaborate cross-functionally with R&D and equipment suppliers to achieve process stabilization and enable scalable advanced packaging schemes.

Education

  • Purdue University

    Doctor of Philosophy - PhD, Mechanical Engineering/Mechanical Technology/Technician

  • Purdue University

    Master's degree, Autonomous vehicle

    2018 — 2020

  • Purdue University

    Bachelor's degree, Mechanical Engineering/Mechanical Technology/Technician

    2010 — 2017

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Dong Hun Lee — Research Development Thin Flim Staff Process Engineer2 at Samsung Semiconductor in West Lafayette, IN, US | Unifers