Dinesh Thanu
Director, Advanced Packaging at Intel Corporation
- Role
- Director, Advanced Packaging and Foundry Development at Intel
- Location
- Portland, OR, US
- LinkedIn followers
- 500 followers
Experience
Director, Advanced Packaging and Foundry Development
May 2025 — Present · Portland, OR, US
Education
Central Electrochemical Research Institute (cecri)
Bachelor's degree, Chemical and Electrochemical Engineering
2002 — 2006
University of Arizona
PhD, Major: Materials Science and Engineering; Minor: Electrical Engineering
2008 — 2011
University of Idaho
M.S, Materials Science and Engineering
2006 — 2007
Skills
- Powder X-Ray Diffraction
- Electrochemistry
- Scanning Electron Microscopy
- Characterization
- Materials Science
- Chemical Engineering
- Spectroscopy
- Thin Films
- Design of Experiments
- Process Engineering
- R&D
- Afm
- Wet Chemical Etching
- Semiconductor Fabrication
- Semiconductor Packaging
- Nanotechnology
- Research and Development (R&D)
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.