Deepak Rajput

Module Engineering Manager - Dry Etch | Experienced in Dry Etch, Laser Deposition, Additive Manufacturing & Thin Film Deposition | Scholar & Mentor | Passionate About Team Building and Automation

Role
Module Engineering Manager at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

Experience

  1. Module Engineering Manager

    Intel

    Aug 2022 — Present · Hillsboro, OR, US

Education

  • National Institute of Technology, Tiruchirappalli

    BTech

    2000 — 2004

  • University of Tennessee, Knoxville

    Doctor of Philosophy (Ph.D.)

    2009 — 2013

  • University of California, Berkeley

    Technology Leadership Program (Executive Certificate)

    2024 — 2025

  • University of Tennessee, Knoxville

    Master of Science (M.S.)

    2006 — 2008

Skills

  • Research and Development (R&D)
  • Powder X-Ray Diffraction
  • Matlab
  • Nanotechnology
  • Steel
  • Characterization
  • Spectroscopy
  • Scanning Electron Microscopy
  • Materials Science
  • Experimentation
  • Design of Experiments
  • Heat Treatment
  • R&D
  • Engineering
  • Semiconductors
  • Metallurgy
  • Mechanical Testing
  • Electrochemistry
  • Polymers
  • Mathematica
  • Simulations
  • Laser
  • Nanomaterials
  • Thin Films

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Deepak Rajput — Module Engineering Manager at Intel in Hillsboro, OR, US | Unifers