Deenesh Bundi
Principal Engineer | Semiconductors | CMP | Process Engineering | Process Improvement | New Product Introduction | High Volume Manufacturing | 3D XP | 3D & 2D NAND | Strategic Planning | Mentor | Mechanical Engineering
- Role
- Ltd be Planar Process Engineer at Intel
- Location
- Lehi, UT, US
- LinkedIn followers
- 500 followers
Experience
Ltd be Planar Process Engineer
Dec 2021 — Present · Hillsboro, OR, US
Designing, performing, and analyzing experiments to develop processes and meet technology requirements• Collaborating with various internal and external stakeholders on project issues requiring coordination across multiple functional areas.• Developing equipment to enhance functionality and improve the process (in collaboration with equipment suppliers), driving equipment suppliers to identify shortcomings, proposing, and evaluating hardware modification to resolve issues.• Partnering with Global Supply Chain (GSC) and external vendors to develop consumables, hardware, metrology, operational methodology, and automation systems to meet challenging program goals• Participating in the development of intellectual property
Education
Sri Venkateswara University
Bachelor of Technology (BTech), Mechanical Engineering
1998 — 2002
Clarkson University
Master of Science (MS), Mechanical Engineering
2003 — 2005
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