Dean Smith
Principal Field Applications Engineer, Systems Engineering @Idt - Integrated Device Technology, Inc. Acquired By Renesas
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WORK HISTORY
Principal Field Applications Engineer, Systems Engineering @Idt - Integrated Device Technology, Inc. Acquired By Renesas
CA
July 2017 – Present (NC, SC, GA, FL, TN, MS, and Chicago)- Aug 2003 – Jun 2017 (Ottawa, Toronto, Montreal, Central and Western NY)- Sep 2001 – Jul 2003 (Upstate NY, Metro NY, Northern NJ)* Summary of Key Technologies Supported, Proficiency- Timing - Sync Fabric (SyncE/1588), Server & PC, FPGA, SerDes, Micro, XTAL & XO- RF Signal Chain - Phased Array Radar, Satcom, BTS, Tactical Radio- Sensors - Position Sensors, Gas Sensors, Humidity Sensors, Flow Rate Sensors- Power - Wireless Power Delivery (WPC/AirFuel), SoC PMIC- System Interconnect - PCIe Switch/Bridges, sRIO Switches, Repeaters/Re-timers- MIPS CPU Network Search Engines (Content Addressable Memory)- Switch Fabric and Traffic Management ICs- Traditional Telecom (T1/E1 LIUs and Framers, TSIS, CODEC)- Memories (SRAM, FIFO, Dual-Port SRAM)- High-speed Interface Logic* Summary of Key Applications, Markets, Sectors Supported, Proficiency- Wireline Networking and Communications- Wireless Infrastructure and Communications- IoT, Industrial and General Embedded - Military and Aerospace- High Performance Computing- Mobile and Personal Electronics- Automotive- Office Automation (Printer/Copier/Multi-Function)* Management of Technical Sales Process from Opportunity Discovery to Design-In (DI)* Proven and Respected Customer Design Partner, via both Pre- and Post-DI Technical Support * Lead FAE often called upon by Sales and Product Lines Execs for various activities- Customer-centric New Product Definition Ideas and Inputs- Technical “Deep Dive” Product and Market Overviews, w/Presentation to Product Line Execs- Generation and/or Review of Corporate Marketing Technical Presentations* Generation of numerous Product and Application Collateral Pieces- App Notes, White Papers, Articles- Customer Facing Technology and Use Case Presentations- Channel Facing Application Tutorials
EDUCATION
Rochester Institute of Technology
BSEE, Electrical and Electronics Engineering
SKILLS
ABOUT DEAN SMITH
Director of FAE at Renesas Electronics America
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