Dawit Solomon

About Dawit Solomon

Engineering Professional with extensive experience in Microelectronics Packaging, including IC Package Architecture Definition, IC Package Characterization, and IC Package Design. Tool owner for Defect Inspection and Metrology tools used in Microelectronics Packaging. Career Highlights- Demonstrated success in leading cross functional teams into defining, developing and transferring technology to multiple manufacturing sites- Led package definitions and designs adhering to performance, cost and schedule targets for a variety of INTEL product segments such as INTEL’s CPUs, Discrete Graphics, Embedded, Servers, Communication, Memory Products- Led the effort to Define and implement low cost inspection strategy for INTEL low cost products, such as smartphones and tablets with significant revenue gain to the business groups- Received multiple INTEL divisional recognition awards and recognized for contributions to packaging in the areas of process, package development, die/package/board co-design and low cost package design solutions that delivered significant cost savings to product teams- Author of multiple publications (ECTC, Semiconductor Packaging Symposium, 1st International Conference on Multichip Modules), patent and IPs (IP.com) relevant to electronics packaging. Hardware/Software Skills- Tool Owner: OMRON VT-X700 3D X-Ray Tool - ICOS (T130) Automatic Visual Inspection System - 850 HD Machine Vision Systems (MVS)- Semiconductor Device Analyzer- Agilent Vector Network Analyzer (VNA)- FEA: COSMOS/M, AutoCAD, Cadence APD, JMP (Statistical Software)

Experience

1. Principal Engineer - Packaging

   Microchip Technology Inc.

   Jan 2018 — Present · Chandler, AZ

Education

• The American University in Cairo

  BS

• Arizona State University

  MS/MSE