David Huang

President, Global Thermal Division, and Asia Pacific @Boyd

Concord, NH, US
EMAILS
d••••••••@boydcorp.com
MOBILE NUMBERS
+16•••••••88

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WORK HISTORY

Sep 2023 — Present

President, Global Thermal Division, and Asia Pacific @Boyd

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In this role, David is responsible for the company\'s global thermal business, and has corporate responsibility for Boyd’s Asia Pacific region, the largest of three regional operating groups of Boyd Corporation.

EDUCATION

1994 — 1996

University of Massachusetts Dartmouth

MBA

SKILLS

Product DesignSix SigmaProduct DevelopmentR&DLean ManufacturingEngineering ManagementSupply Chain ManagementCross-Functional Team LeadershipProduct ManagementEngineeringElectronicsContinuous ImprovementSemiconductorsManufacturingProcess Engineering

ABOUT DAVID HUANG

Executive with more than 25+ years of leadership in global operations leadership, managing P&L, M&A, global sales, design, manufacturing, and strategic sourcing in private equity held companies. Extensive experience in winning global strategic customers across the hyperscale datacenter/AI, EV, enterprise, and telecommunication and semiconductor industries. Exceptional track record for driving top line revenue, and pushing EBIDTA growth.

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