Dave Ozorowski

About Dave Ozorowski

New semiconductor test technology introduction with embedded software- Probe Process management and optimization- PCBs: Working with multi-layer, RF and wireless applications. I CRUSH it. Utilizing different materials including Aluminum Metal Core & Rigid Flex- Prototype and small volume for 2-30 layer boards. Sweet spot is 6 -24 layers. RF boards are mostly on Rogers and FR4 hybrids- ZUKIN for board layout - DX Designer EE7 for Schematics - Mixed-signal devices, Teradyne testers, UltraFlex and IGXL, data scripted with (Perl, Python, I have 27k+ connections primarily in Semiconductor and Electronics manufacturing. I am more than happy to make introductions if you have a business need. I find this is the true business power of LinkedIn. If you are looking for someone, I may have an intro \"IN\" for you- Assist customers in designing, manufacturing, and testing devices with RF-enabled embedded micro-controllers- 70% of the products are marketed to Europe, America, Asia-Pacific, etc- Working on a new wireless protocol for the Internet-of-Things- Analysis of devices, chips, water, boards, optics, lasers, MEMS, batteries-Analog Full-Circuit PLL Verification-Full-Circuit ADC Verification with Analog FastSPICE-High-Performance ADC Simulation -High-Performance Analog and RF Circuit SimulationGood awareness of the market dynamics and products in a highly competitive server, storage, and cloud market.Also, in terms of Networking, I have been passing along resumes with some surprising success!

Experience

1. Senior Engineer

   Siemens

   Jan 2012 — Present

   New semiconductor test technology introduction • Probe Process management and optimizationAnalog /Power Systems - Including • Power-amps, power supplies, Transistors, op-amps, PWM switching, A/D, D/A, PSPICE, sensors, DC-DC, Delta-Sigma• Instituted experiments with rapid turnaround to solve in-process yield issues.• Frequent customer interaction, and contract development work.• Close interaction with fab personnel to resolve problems and develop new MEMs products.Device and Circuit Analysis• Working closely with silicon engineering to bring down products DPPM levels to meet our quality targets

Education

• Southern Illinois University, Carbondale

  Associates of Engineering

  1990 — 1992

• Texas A&M University

  Bachelor's Degree

  1992 — 1994

Skills

• Design for Manufacturing
• Analog
• Wireless
• Process Engineering
• C++
• Ic
• Debugging
• Program Management
• Wireless Technologies
• Systems Engineering
• Continuous Improvement
• Product Management
• Test Equipment
• Eingebettete Systeme
• Hardware Architecture
• C
• Programming
• Matlab
• Engineering Management
• Linux
• Testing
• Electrical Engineering
• Software Development
• Cross-Functional Team Leadership
• Digital Signal Processors
• Process Improvement
• Fpga
• Embedded Software
• Manufacturing
• Hardware
• R&D
• Firmware
• Microcontrollers
• Management
• Verilog
• Troubleshooting
• Electronics
• Root Cause Analysis
• Ingenieurwissenschaften
• Labview