Darshan Honnesh

Packaging Research & Development @Strides | ITC LIMITED | Printing and Packaging Engineer - SIES Graduate School of technology. Mumbai

Role
Packaging Development Executive at Strides
Location
Mumbai, MH, IN
LinkedIn followers
500 followers
Manufacturing & ProductionView LinkedIn profile

About Darshan Honnesh

I am a junior packaging science major at (SIES) Mumbai university. with a minor in printing technology. The Mumbai university packaging science curriculum as well as the different organisations I have been a part of have provided me with the ability to work with independently and in a group. Tackle problems head - on. lead a group. and think creativity. I am set to graduate in July of 2023 and I look forward to pursue all opportunities that will best prepare me for a sailing.

Experience

  1. Packaging Development Executive

    Strides

    Jun 2023 — Present · Bengaluru, IN

    Development of new packaging materials required for formulation development studies.• Primary packaging materials proposal for lab scale/scale up batch stability studies.• Preparing protocols & taking machine trails at plant for Alternate vendor development and new change parts.• Finalization of change parts, primary & secondary packaging materials for new products in consultation with FD/Plant.• MVTR test for Container, Closure & Blisters and reporting the raw data into Laboratory Note Book.• Preparation of PKDR, BOM’s, Trade dress, Specification/STP & Drawings.• Requisition for Item codes, preparation of calculation sheets, checking and approval for MPR’s.• Coordinating for the change part development and arranging sample for machine trials.• Providing inputs for artwork preparation for submission purpose and finalization of secondary, tertiary packaging materials for intended MPR.• Ensure maintenance of correspondence and technical information pertaining to packaging activities comply with Standard Operating /Testing Procedures.• Finding the Alternate source for Packaging Material and developing the PM as required Specifications for laminates & rigids.• Device Developments with the vendor on Pre & Post Modeling • Ensure maintenance of GLP for PDC laboratory and ensure proper arrangement of PDC documents.

Education

  • SIES Graduate School Of Technology

    Printing and packaging technology

    2020 — 2023

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Darshan Honnesh — Packaging Development Executive at Strides in Mumbai, MH, IN | Unifers