Dan Kochpatcharin
- Role
- Head of Design Infrastructure Management at TSMC
- Location
- Fremont, CA, US
- LinkedIn followers
- 500 followers
About Dan Kochpatcharin
Global Technology Executive, Semiconductor—Product/Business Development, R&D…
Experience
Head of Design Infrastructure Management
Jun 2022 — Present
Leads OIP Ecosystem Partnerships: 3DFabric Alliance, IP Alliance, EDA Alliance, DCA, Cloud Alliance, and VCA
Skills
- Product Marketing
- Program Management
- Analog
- Ip
- Embedded Software
- Embedded Systems
- Eda
- Ic
- Application-Specific Integrated Circuits (Asic)
- Cross-Functional Team Leadership
- Strategic Partnerships
- System on a Chip (Soc)
- Mixed Signal
- Product Management
- Soc
- Mobile Devices
- Management
- Strategy
- Process Improvement
- Product Development
- Start-Ups
- Asic
- Wireless
- Strategic Planning
- Semiconductor Industry
- Supply Chain
- Leadership
- Electronics
- Cmos
- Semiconductors
- Marketing
- Manufacturing
- R&D
- Integrated Circuits (Ic)
- Simulations
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