Daniel Yao
Technology Development Engineer at Intel Foundry
- Role
- Module Development Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
Experience
Module Development Engineer
Jul 2024 — Present · Hillsboro, OR, US
Wafer Assembly Technology Development, Advanced Packaging
Education
Moorpark College
Applied Mathematics
UC Berkeley College of Engineering
Bachelor of Science - BS
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