Dan I.

Experience

1. Principal Firmware Software Engineer

   Microsoft

   Jul 2014 — Present · Redmond, WA, US

   Playing critical role in design and implementation of numerous Surface devices, from concept to bring-up, manufacturing, mass production and post launch engineering• Leading the technical collaboration with our Silicon partners (Intel, Qualcomm, AMD, Nvidia, NXP), OS Group and HW Team in multiple areas, including UEFI, Debug, Power/Performance, System Integration, and future Silicon and OS improvements• Driving long term strategies in Surface, Microsoft, and Silicon partners, e.g, improving power/performance in Windows devices, lower abnormal shutdowns etc.• Leading multi-year, industry first, effort to improve debuggability of Surface devices, in partnership with Silicon and OS partners: MIPI I3C Debug, secure JTAG of production devices, FW Crash collection in the field, advanced HW telemetry etc.• UEFI development/architecture for Surface devices, including industry leading features like DGPU Hot Plug, ACPI D3Cold, secure Production debug, cutting edge Power/Performance optimizations, government compliance• Mentoring a team of talented IC engineers, guiding their technical growth towards next-generation architects• Implementation/debug expertise of full stack of modern devices: Silicon, HW, FW, Drivers, OS and Apps• Investigated and fixed some of the most difficult issues that the Surface team encountered, that required cooperation between multiple orgs inside Microsoft and teams outside MS as well (Intel, Nvidia, Qualcomm, Samsung etc.)• Team lead expert in numerous high and low speed busses: PCIe, USB, SPI, I2C, UART, SWD, JTAG• Designed multiple PCBAs (Cadence/OrCAD) to support Surface team development effort. Full end-to-end implementation: HW, FW, SW, OS. HW Prototyping and Debugging: oscilloscope, bus analyzers, precision soldering station, microscope, and other tools

Education

• Universitatea Tehnică a Moldovei

  Master’s Degree, Computer Engineering.