Daijiao Wang
- Role
- Thermal Technical Lead at Broadcom
- Location
- Los Angeles, CA, US
- LinkedIn followers
- 500 followers
About Daijiao Wang
Extensive experience in electronics thermal design analysis from IC package to handheld…
Experience
Thermal Technical Lead
Jul 2008 — Present
Thermal technical lead of six engineers responsible for advanced thermal technologies development and new material research, and thermal architecture design of all Broadcom products from silicon to system levels.
Skills
- Ic
- Thermal
- Engineering
- Testing
- Failure Analysis
- Cfd
- Engineering Management
- Integrated Circuits (Ic)
- Mechanical Engineering
- Heat Transfer
- Computational Fluid Dynamics (Cfd)
- Electronics
- Manufacturing
- Ansys
- Design of Experiments
- Semiconductors
- Simulations
- Electronics Packaging
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