Cuono Massimo Amoruso

Quality & Process Engineer @Leonardo

Cisterna Di Latina, IT

Focal point and responsible for adeguate company procedure and organization for Nadcap Audit for the following special process:CIRCUIT CARD ASSEMBLIES (Check list AC 7120)More specifically, my principal responsibilities are- Process improvement of Circuit card assemblies: Surface Mount Technology, Through-hole technology, Conformal Coating, Encapsulation, Bonding- Updating and implementation of the technical documents:o Operative Instruction: Printing machine, SPI, Pick & Place, Oven Reflow, AOI, X-ray, Selective soldering machine;o Technological Instruction: Paralell gap, Press-fit, EDS, Encapsulation, Lead-free control Plan- Product development and industrialisation (Routing card, Work Order, Times and Methods)- Root Cause Analysis- Six Sigma methology- Lean Manufacturing- Transfer of Technology from Cisterna di Latina site to Ankara (Turkey) site of the production line for Electronic Assemblies- Qualification and Validation related to internal and external special processes: Soldering, Conformal coating Crimping, Torque tightening, Encapsulation, Bonding

Università degli Studi di Napoli Federico II

INGEGNERIA GESTIONALE DELLA LOGISTICA E PRODUZIONE