Cliff Oglesby

About Cliff Oglesby

Senior Member Technical Staff (Emeritus)| Semiconductor Operations & Lifecycle LeaderThroughout a 40-year career at Texas Instruments, I have specialized in the high-stakes engineering and operational shifts that define the semiconductor lifecycle—from the integration of billion-dollar acquisitions to the strategic decommissioning of legacy facilities.My tenure has been defined by three core pillars of impact:1. Strategic M&A & Technology IntegrationI led the complex \"process porting\" and qualification of high-performance analog technologies from acquired entities, including Burr-Brown and Unitrode, into the TI manufacturing ecosystem. My focus was ensuring that these elite recipes maintained \"Golden Yield\" and parametric stability while moving into TI internal fabs.2. The SFAB Analog PivotI orchestrated the technical transformation of the SFAB (Sherman) facility, successfully pivoting the site from its legacy logic-only roots into a high-performance analog powerhouse. By transferring products from DFAB (Dallas) to SFAB, I enabled critical capacity expansion for newer technologies while establishing the analog foundations.3. Lifecycle Management & DecommissioningAs a Senior Member Technical Staff (Emeritus), I am currently leading the systematic wind-down and decommissioning of the 150mm SFAB facility. My mission is to ensure 100% supply continuity for automotive and industrial partners while successfully transitioning decades of operational knowledge and technical assets toward TI’s future-state manufacturing hubs.I believe in the \"Copy Intelligently\" philosophy—not just for wafers, but for the standards of excellence, quality, and technical integrity that sustain a global semiconductor leader.

Experience

1. Wafer Fab Product Engineering Manager

   Texas Instruments

   Mar 2000 — Present · Sherman, TX, US

   Drove long-term yield improvement and parametric test optimization for high-volume automotive and industrial analog productsSpearheaded the complex process transfer of high-performance analog technologies from acquired entities including Unitrode and Burr-Brown into internal TI wafer fab.Directed the successful migration of critical product families from shuttered legacy facilities to the SFAB high-volume manufacturing (HVM) facility, with improved yield and supply continuity during major corporate restructuring.Managed the technical team through a multi-year closure plan, focusing on maintaining high yield and parametric stability until site completion

Education

• Southern Arkansas University

  Pre-Engineering, Electrical Engineering

  1978 — 1980

• Southern Methodist University

  MSEE, Electrical Engineering

  1983 — 1986

• University of Arkansas

  BSEE, Electrical Engineering

  1980 — 1983

Skills

• Asic
• Static Timing Analysis
• Analog
• Product Engineering
• Physical Design
• Cmos
• Characterization
• Manufacturing
• Primetime
• Rtl Design
• Ic
• Power Management
• Dft
• Engineering
• Integrated Circuit Design
• Analog Circuit Design
• Mixed Signal
• Low-Power Design
• Semiconductors
• Soc
• Timing Closure