Cliff Lee

About Cliff Lee

Technical leader in PC system architecture, SOC package design integration, PCB manufacturing, and hardware supply chain operation. Excellent track records of high volume production design execution focus on time-to-market, performance and cost management. Passionate in bringing new technologies to markets.

Experience

1. Principal Engineer, Silicon Packaging

   Microsoft

   Jan 2021 — Present

   Silicon-package-system co-design for Azure high performance computing data center products (Cobalt, Maia).• Led team to architect/design/tapeout SOC packages for Azure silicon products.• Silicon floorplan architecture optimization for system IO and package technology.• IC package fabrication and assembly design rules roadmap development with manufacturing factories.• Drove advanced signal/power integrity designs for IC packaging.• Defined test chips/interposers/substrates to innovate 2.5D/3D package technologies.• Drove IC packages design for cost and yield improvements.

Education

• University of Washington

  BSEE

• Cornell University

  M.Eng.

Skills

• Intel Architecture
• Customer Engagement
• Cadence
• Hardware Architecture
• Ic
• Program Management
• Strategic Sourcing
• Soc
• Pcb Design
• Asic
• Pcie
• Microprocessors
• Cross-Functional Team Leadership
• Spice
• Global Sourcing
• System on a Chip (Soc)
• Product Road Mapping
• Low-Power Design
• Power Delivery
• Signal Integrity
• Simulations
• Intel
• Technical Staff Management
• Computer Architecture
• Ic Packaging
• Processors
• Integrated Circuits (Ic)
• Testing
• Logic Design
• Semiconductors