Ciera Cipriani

Intel Process Engineer | PhD in Materials Science

Role
Ltd Module and Integration Yield Engineer - Dry Etch at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Ciera Cipriani

Motivated scientist and engineer passionate about designing materials and processes for…

Experience

  1. Ltd Module and Integration Yield Engineer - Dry Etch

    Intel

    Feb 2024 — Present · Hillsboro, OR, US

    Drive materials characterization (SEM, EDS, TEM, optical ellipsometry) and data analysis (SQL, JMP) for rapid development of Intel 18Å transistor by tuning critical dimensions through dry etching.Lead 2 weekly presentations across multiple teams (~60 attendees) to communicate progress on reducing etch tool variation and new technology pathfinding.Reduced wafer waste annual savings) via design of experiments, materials characterization, and statistical analysis to problem-solve and validate etch protocol.

Education

  • North Carolina School of Science and Mathematics

    High School

    2012 — 2014

  • North Carolina State University

    Master of Science - MS

    2018 — 2019

  • North Carolina State University

    Bachelor’s Degree

    2014 — 2018

  • Texas A&M University

    Doctor of Philosophy - PhD

    2019 — 2023

Skills

  • Polymer Chemistry
  • Social Media
  • Imovie
  • Molecular Modeling
  • Drumming
  • Adobe Premiere
  • Teamwork
  • Research
  • Materials Science
  • Customer Service
  • Computational Chemistry
  • Engineering
  • Garageband
  • Microsoft Office
  • Performing Arts
  • Audacity
  • Problem Solving
  • Academic Libraries
  • Gaussian
  • Unit Conversions
  • 3d Printing

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Ciera Cipriani — Ltd Module and Integration Yield Engineer - Dry Etch at Intel in Hillsboro, OR, US | Unifers