Chirag Deshpande
Intel Corporation | Texas A&M | BITS Pilani
- Role
- Packaging R & d Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Packaging R & d Engineer
Feb 2022 — Present · Hillsboro, OR, US
Education
Birla Institute of Technology and Science, Pilani
Msc, Physics
2014 — 2019
Birla Institute of Technology and Science, Pilani
Bachelor of Engineering - BE, Mechanical Engineering
2014 — 2019
Texas A&M University
Master of Science - MS, Mechanical Engineering
2019 — 2021
Shikshan Prasarak Mandalis Sir Parshurambhau College Arts, Science & Commerce Tilak Road Pune 30
Science
2012 — 2014
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