Tuan
Technical Program & Integration Lead at Intel Corporation
- Role
- Technical Program & Integration Lead, Substrate Td at Intel
- Location
- Chandler, AZ, US
- LinkedIn followers
- 500 followers
Experience
Technical Program & Integration Lead, Substrate Td
Jun 2021 — Present · Chandler, AZ, US
Directed multi-generations of client substrate TD programs through full product life cycle- Delivered Lunar Lake substrate from TD/NPI to cert/HVM; de-risked reliability and warpage/SMT issues. Intel Foundry TD Excellence Award for delivering Lunar Lake cert & ramp- Improved Raptor Lake assembly throughput by 566% via BEOL material/process optimization- Enabled $22.4M cost reduction through high-density routing design- 2 ATTD Divisional Awards & 2 SPTD Department Awards.
Education
University of California, Berkeley
Bachelor of Science
2008 — 2012
Georgia Institute of Technology
Doctor of Philosophy (PhD)
2012 — 2017
Skills
- Thermal Analysis
- Spectroscopy
- Powder X-Ray Diffraction
- Nanomaterials
- Chemistry
- Tem
- Afm
- Polymer Composites
- Research
- Electronics Packaging
- Scanning Electron Microscopy
- Materials Science
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