Chenxi Huang
IC Packaging Engineer at Apple
- Role
- Ic Packaging Design at Apple
- Location
- Rolla, MO, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Ic Packaging Design
Aug 2018 — Present
Skills
- Matlab
- Cadence Xtracim
- Ads
- Cst Microwave Studio
- Cadence Powerdc
- Cadence Powersi
- Hspice
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