Chaima Zrelli
Ingénieur Package Design @STMicroelectronics
Grenoble, FR
EMAILS
MOBILE NUMBERS
+91 *********19
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WORK HISTORY
Jan 2022 — Present
Ingénieur Package Design @STMicroelectronics
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Grenoble, FR
EDUCATION
2018 — 2020
Universite de Lorraine
Master 2 , EEA parcours Capteurs intelligents et micro-nano-technologies
2014 — 2017
Institut Superieur
Licence appliquée , Technologies / techniciens du génie électrique
ABOUT CHAIMA ZRELLI
Ingénieur Package Design
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