Carl Benes
Principal Electrical Engineer
- Role
- Asic Packaging Applications Engineer at Marvell Technology
- Location
- Burlington, VT, US
- LinkedIn followers
- 500 followers
Experience
Asic Packaging Applications Engineer
Nov 2019 — Present · Burlington, VT, US
Design of microelectronic packages for custom SoC in the Artificial Intelligence, Networking and Datacenter markets-Development of leading-edge advance packing solutions including organic interposers, co packaged connectors, custom HBM, large body, embedded components, and chiplet integration-Define connectivity, power supply, and mechanical requirements for customer specific modules-Signal Integrity and Power Integrity simulation analysis including direction of layout and analysis teams
Education
Northeastern University
BA, Electrical Engineering
2008 — 2013
Skills
- Emc Compliance
- Rfid
- Digital Amplifiers
- Electrical Engineering
- Electronics
- Pcb Design
- Testing
- Product Development
- Analog Circuit Design
- Hardware
- Matlab
- Troubleshooting
- Manufacturing
- Engineering
- Rfid+
- C++
- Process Improvement
- Rf
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