Baltazar C.
Senior Manager, Ic Package Design & Simulation (Thermal and Mechanical) @Renesas Electronics
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WORK HISTORY
Senior Manager, Ic Package Design & Simulation (Thermal and Mechanical) @Renesas Electronics
Kirchheim unter Teck, DE
EDUCATION
Mapúa University
Master of Science, Materials Engineering
Technological University of the Philippines
Bachelor of Science, Mechanical Engineering
ABOUT BALTAZAR C.
Technology Development, Finite Element Analysis (FEA), Fracture Mechanics, Chip-Package Interaction, Warpage, Solder Joint Reliability, Thermal Characterization, Thermo-Mechanical Modeling, Material Testing and Characterization, New Package Introduction, Process Engineering, Assembly Packaging Design, IC Package Assembly Concept Development and Project Management.WLCSP, Flipchip, BGA, System in Package, Package on Package, Stacked Die, MEMS.Ansys Workbench, Ansys Mechanical APDL, LS Dyna, Ansys Icepak, Flotherm.
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