Bud Troche
Sr Director Wafer Level Packaging @MacDermid Alpha Electronics Solutions
Phoenix, AZ, US
EMAILS
b••••••••@macdermidalpha.com
MOBILE NUMBERS
+91 *********19
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WORK HISTORY
May 2024 — Present
Sr Director Wafer Level Packaging @MacDermid Alpha Electronics Solutions
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Gilbert, AZ, US
EDUCATION
1984 — 1986
Heald College
Electronic Engineering
SKILLS
MicroelectronicsCross-Functional Team LeadershipSocNanotechnologyAsicIcCmosIntegrated Circuits (Ic)Statistical Process Control (Spc)Design for ManufacturingAnalogCharacterizationProgram ManagementSimulationsSiliconMetrologyProcess SimulationPower ManagementProcess IntegrationPcb DesignYieldElectrical EngineeringFmeaProduct DevelopmentSemiconductor PackagingEdaProduct EngineeringProduct ManagementSpcDesign of ExperimentsManufacturingEngineering ManagementMixed SignalConsumer ElectronicsReliabilitySemiconductorsOpticsProcess EngineeringFailure Mode and Effects Analysis (Fmea)Electronics
ABOUT BUD TROCHE
Solid experience in sales, account management and business development in an…
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