Brian Stump
RFIC Design Engineer at Teledyne
- Role
- Senior Analog Ic Design Engineer at Teledyne LeCroy
- Location
- Austin, TX, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Senior Analog Ic Design Engineer
Nov 2021 — Present
Analog designer for world’s first integrated digital radar chip. Owner of verification/validation for the RX and PLL subsystems. Performed all jobs necessary to take chip into production with FUSA automotive certification: layout, emir/aging/corner simulations, and lab validation.
Skills
- Cadence
- Rf
- Labview
- Semiconductors
- Cst Microwave Studio
- Circuit Design
- Electrical Engineering
- Awr Microwave Office
- Analog Circuit Design
- Ltspice
- Microwave Circuit Design
- Pcb Design
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.