Bohan Shan
Technologist, Advanced Packaging R&D
- Role
- Technologist, Advanced Packaging R & d at Intel
- Location
- Tempe, AZ, US
- LinkedIn followers
- 500 followers
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About Bohan Shan
Intel ATD Technologist with 5+ years of experience in advanced packaging R&D…
Experience
Technologist, Advanced Packaging R & d
Sep 2025 — Present · Chandler, AZ, US
Education
Arizona State University
Doctor of Philosophy (Ph.D.), Chemical Engineering
2014 — 2017
Arizona State University
Master of Science (MS), Chemical Engineering
2012 — 2014
Tianjin University
Bachelor of Engineering (BE), Chemical Engineering
2008 — 2012
Skills
- Chemical Engineering
- Differential Scanning Calorimetry
- Nanoparticle Encapsulation
- Scanning Electron Microscopy
- Nanomaterials
- Hydrostable Metal-Organic Frameworks
- Gas Separation
- Material Mechanical Characterizations
- Inorganic Materials
- Membrane & Thin Films
- Material Surface Characterizations
- Material Synthesis
- Smart Materials
- Tga
- Sem
- Transmission Electron Microscope
- Uv-Vis
- Blender
- 2d Materials
- Tem
- Porous Materials
- Pxrd
- Material Characterization
- Six Sigma
- Lab Management
- Data Processing
- Dsc
- Autocad
- Chemical Vapor Deposition (Cvd)
- Bet
- Ft-Ir
- Pl
- Material Microstructure Characterizations
- Data Visualization
- High Pressure Adsorption
- Polymer Materials
- Metal-Organic Frameworks
- Dynamic Mechanical Analysis
- Lab Safety & Managing
- Monte Carlo Simulation
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