Harry Bloom

Role
Mnand Product Engineering Umcp Development Lead at Micron Technology
Location
Boise, ID, US
LinkedIn followers
500 followers

About Harry Bloom

Senior Product Line Manager specializing in semiconductor memory technologies, including…

Experience

  1. Mnand Product Engineering Umcp Development Lead

    Micron Technology

    Mar 2022 — Present

    Promoted to lead the MNAND MCP Product Engineering Team. People leader to a team of skilled engineers and leaders who collectively represent MCP PE for Micron\'s Global NPI MCP portfolio. Responsible and accountable for all MCP PE activities. Serve as cross-functional point of contact for MNAND LPDRAM related items and overall MCP PE product execution (LP4/5+NAND+ASIC).

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Harry Bloom — Mnand Product Engineering Umcp Development Lead at Micron Technology in Boise, ID, US | Unifers