Birger Pahl

Head of Hardware R&D at SPAN

Role
Head of Hardware R & d at SPAN
Location
Milwaukee, WI, US
LinkedIn followers
500 followers

About Birger Pahl

R&D electronics engineer with more than 24 years of experience in analog electronics, signal processing, power electronics, power distribution & protection, sensor technologies, and embedded systems. Technical lead, project manager, and contributor on research projects leading to new products. Principle Investigator leading multi-disciplinary teams including academic and national lab partners for government funded research.

Experience

  1. Head of Hardware R & d

    SPAN

    Feb 2022 — Present · Milwaukee, WI, US

    Building up a research group to develop technologies that will help rapidly advancing home electrification.

Education

  • University of Wisconsin-Milwaukee

    Engineering graduate level courses in Electrical and Computer Engineering

    2000 — 2003

  • Milwaukee School of Engineering

    BSEE, Electrical Engineering

    1995 — 1996

  • Technische Hochschule Lübeck

    Dipl.-Ing., Electrical Engineering Communication Systems

    1992 — 1996

Skills

  • Fmea
  • Power Systems
  • Embedded Systems
  • Electrical Engineering
  • Electronics
  • Simulink
  • Power Electronics
  • Automation
  • Simulations
  • Engineering
  • Six Sigma
  • Engineering Management

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Birger Pahl — Head of Hardware R & d at SPAN in Milwaukee, WI, US | Unifers