Bill Gioiosa

Experience

1. Principal Applicatons Engineer

   Renesas Electronics

   Jan 2018 — Present · MI, US

   High speed memory interface design for LPDDR4, DDR3/3L, DDR2, etc. High speed serial interface design including HDMI, LVDS, CSI, Ethernet (standard and automotive T1), SATA, USB3.0, USB2.0, PCIe, SERDES.Design experience in ADAS, Radar, MMIC, Infotainment, Reference Board Design and Development, Advanced instrument clusters, Head up displays, powertrain, and body modules. Circuit design and simulation for system inputs and outputs including, but not limited to, analog and digital inputs, network interfaces (CAN, LIN, Ethernet, MOST), power drivers, expanders, memory interfaces for non-volatile memory (FLASH, eMMC, SDIO), SPI, I2C, I2S, UART.Multi-processor design and interface, system power domain isolation within a module design, power supply design and sequencing.ARM core processor experience includes Renesas R-CAR (Multi-core SoCs), Freescale/NXP i.mx processors, and TI Jacinto.Design and Simulation Tools: Cadence Allegro schematic, layout, high speed simulation (Sigrity) software, Mentor Graphics Schematic, layout, high speed simulation (Hyperlynx) software, Zuken schematic and layout software.PCB design for high speed (stack-up, impedance matching, trace length, separation, crosstalk), EMC, and power.Worst case design and analysis (Automotive), Electrical team lead, minor software experience. Customer and Supplier system requirements and hardware development.

Education

• University of Michigan-Dearborn

  BSEE, Electrical Engineering

  1979 — 1983