Bijoyraj Sahu
Principal Engineer, Silicon Packaging Architect @ Intel Corporation | Ph.D. Mechanical Engineering
- Role
- Principal Engineer at 英特尔
- Location
- San Diego, CA, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Bijoyraj Sahu
Principal Engineer specializing in IC Packaging Architecture, driving innovation in advanced packaging, system integration, and high-performance computing.
Experience
Principal Engineer
Jul 2025 — Present · San Diego, CA, US
Education
University of Florida
Ph. D., Mechanical Engineering
2010 — 2013
University of Florida
M.S, Mechanical Engineering
2008 — 2010
University College of Engineering, Burla
B.E, Mechanical Engineering
1999 — 2003
Skills
- Patent Searching
- Mechanical Testing
- Abaqus
- Materials Science
- Photolithography
- Solidworks
- Igor Pro
- Comsol
- Numerical Analysis
- Design of Experiments
- Experimentation
- Mechanical Engineering
- Afm
- Mems
- Matlab
- Characterization
- Simulations
- Labview
- Hypermesh
- Physics
- Ansys
- Scanning Electron Microscopy
- Drie
- Microsoft Office
- Microfabrication
- Pro Engineer
- Finite Element Analysis
- Nanotechnology
- Wet Chemical Etching
- Testing
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