Bianzhu Fu

Failure Analysis Engineer @Intel

Hillsboro, OR, US
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Jul 2021 — Present

Failure Analysis Engineer @Intel

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Hillsboro, OR, US

EDUCATION

N/A

Georgia Institute of Technology

Master's degree, Computer Science

2011

The University of Alabama

Ph.D, Metallurgical and Materials Engineering

2007

Huazhong University of Science and Technology

Bachelor

SKILLS

Materials ScienceFailure AnalysisElectron MicroscopyTem Sample PreparationJmpPhysical Vapor Deposition (Pvd)DramMagnetron SputteringDesign of ExperimentsFibEpitaxySramSemMfmAgmXpsMaterials CharacterizationVacuumPowder X-Ray DiffractionHard DrivesSputteringPhotolithographyMagneticsNanomaterialsX-Ray MicroanalysisTemVsmAfmMagnetic RecordingSemiconductorsThin FilmsEtchingAtom ProbeThin Film DepositionPlasma EtchScanning Electron MicroscopyEdxElectron Beam LithographyCharacterizationCvd

ABOUT BIANZHU FU

Experienced engineer with expertise in the following area: •AI/deep learning based tool automation and metrology•Materials characterization: TEM, SEM-FIB Dual beam, AFM, XRD, XPS, and 3D atom probe•Programming: Python, C/C++, and Java•Data analysis and Machine learning: Pytorch, Tensorflow, scikit-learn, numpy, pandas, openCV •Semiconductor processing: thin films(PVD and CVD), lithography, dry and wet etching, RCI cleaning•Failure analysis: defect/fault isolation, root cause identification

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Bianzhu Fu — Failure Analysis Engineer at Intel in Hillsboro, OR, US | Unifers