Bhagyashree Mishra
Ph.D | Yield & Failure Analysis Engineer | SEM/TEM/FIB Specialist | Driving Yield Improvement & Root Cause Analysis in Semiconductor Manufacturing | Intel
- Role
- Failure Analysis Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Bhagyashree Mishra
I am a Semiconductor Failure Analysis Engineer with hands-on experience in fault isolation, yield improvement, and advanced material characterization, currently working at Intel’s Technology Development group in Hillsboro, OR. My work involves identifying root causes of device failures using cutting-edge techniques such as SEM-based nanoprobing, FIB/SEM, STEM, and various electrical and optical diagnostics (LIT, TADA, IREM, EBAC).At Intel, I’ve collaborated cross-functionally with process integration, yield, and reliability teams to drive data-informed solutions that enhance yield and manufacturing efficiency. My contributions include developing failure analysis protocols that reduced debug cycle time, and leveraging analytical software like Python, MATLAB, and JMP for defect trend analysis and image processing.With a strong academic foundation in materials science and electrical engineering, I’m passionate about deep technology, particularly where materials, devices, and systems converge—such as micro-LEDs, optoelectronics, and next-generation semiconductor platforms.
Experience
Failure Analysis Engineer
Dec 2022 — Present · Hillsboro, OR, US
Education
National Institute of Technology Rourkela
Master's degree, Electrical Engineering
2012 — 2014
Veer Surendra Sai University Of Technology ( Formerly UCE ), Burla
Bachelor of Technology (BTech), electrical engineering
2008 — 2012
Texas State University
Doctor of Philosophy - PhD, Materials Science
2017 — 2020
Skills
- C
- Microsoft Office
- Matlab
- C++
- Ansys
- Power Electronics
- Saber
- Electrical Engineering
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