Bernd Waschneck
Senior Director Advanced Ic Design @Infineon Technologies
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WORK HISTORY
Senior Director Advanced Ic Design @Infineon Technologies
EDUCATION
Maria von Linden - Gymnasium
Abitur
Ludwig-Maximilians-Universität München
Master of Science (M.Sc.), Semiconductor Physics
University of Stuttgart
Dr. (PhD), Advanced Manufacturing Engineering
INSEAD
Infineon ILEAD, Leadership Development
Center for Digital Technology and Management (CDTM)
Honors Degree in Technology Management, Technology Management
National University of Singapore
Semester abroad, Physics
ABOUT BERND WASCHNECK
Global semiconductor R&D leader with strong end-to-end perspective from manufacturing/operations to advanced chip development. I scale innovation to commercial success. As Vice President R&D, I lead 330+ engineers across 6 sites in Asia and Europe, driving results in System-on-Chip design, physical implementation, chip‑package‑board co-design (incl. PCB), Design-for-Test, and RTL2GDS methodology. I build resilient, high-performing organizations, develop leaders, and deliver measurable improvements in execution, productivity, and time-to-market through AI, platform reuse and automation. I complement deep R&D leadership with hands-on experience in semiconductor operations and manufacturing excellence, including time in the Operations Office supporting the COO - strengthening my ability to align technology roadmaps with business strategy, translate priorities into execution, and drive cross-functional change at scale. Academic background: PhD (AI/ML in Manufacturing Engineering, University of Stuttgart); studies in semiconductor physics and technology management (LMU/CDTM, Munich; NUS, Singapore). Academic profile:
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