Benyamin Gholami

About Benyamin Gholami

WHAT I DO:Packaging and modeling engineer with years of experience in thermo-mechanical simulation, finite element modeling, and material characterization. Skilled in leading cross-functional teams and driving innovative modeling methods for semiconductor packaging, reliability, and system integration. Expertise in modeling die/package/socket interactions, stress analysis, and material behavior under various conditions. Experienced in supporting global teams for new product development and OSAT operations.About me-Demonstrated ability to quickly learn complex domains, take initiative, and integrate feedback to deliver technically sound and holistic solutions-Detail-oriented and intellectually curious, frequently exploring beyond assigned scopes to identify risks, opportunities, and system-level impacts-Adaptable in fast-paced, ambiguous environments, with a strong track record of effective collaboration across functions, geographies, and technical disciplines-Known for composure, empathy, and resilience in high-pressure situations, especially when balancing priorities between stakeholders-Experienced in customer and supplier engagement within the semiconductor industry, contributing to design alignment, risk mitigation, and material strategy-Working knowledge of MEMS sensor technologies, including pressure, motion, microphone, time-of-flight (ToF), and industrial-grade IMU modules.

Experience

1. Packaging Engineer

   Sandisk

   Aug 2025 — Present · Milpitas, CA, US

Education

• Arizona State University

  PhD, Mechanical Engineering

  2012 — 2018

Skills

• Simulations
• Finite Element Analysis
• Mathematical Modeling
• Vasp
• Engineering
• Git
• Abaqus
• Simulink
• Ansys
• Numerical Methods
• Algorithms
• Paraview
• Data Analysis
• Comsol Multiphysics
• Linux
• Dft
• Solidworks
• Matlab
• Dream 3d
• Modeling
• Python
• Latex
• C++
• Mechanical Engineering
• Research
• Microsoft Office
• Comsol
• Numerical Analysis
• Corrosion
• Materials S
• C
• Programming